9303-E Power interconnect connectors
By OUPIIN Enterprise Co., Ltd.
Compiled by Factinery from publicly available sources.
9303-E is a mixed-power interconnect family with a published 20.85 mm board height.
9303-E is a mixed-power interconnect family with a published 20.85 mm board height.
Specifications
| Attribute | Value | Conditions | Source |
|---|---|---|---|
| High-power contact current | Up to 120 A/contact | Manufacturer listed high-power value; detailed thermal conditions not stated here. | Official 9303-E product specification. |
| Low-power contact current | Up to 30 A/contact | Separate low-power contact specification, not signal current. | Official 9303-E product specification. |
| Board height | 20.85 mm | Published family profile. | Official 9303-E product specification. |
| Operating temperature | −40 to +125 °C | Published operating-temperature range; current derating still applies. | Official 9303-E product specification. |
Applications
- Power interconnection in electronic assemblies
Sources and updates
Scope of this page: Only the 9303-E model/series and the listed source-supported attributes. Series maximums or model-dependent ranges are identified in the conditions; options and prices are not inferred. Only this explicitly named connector configuration/series is represented; individual member part numbers are not additional quota records. Current figures are manufacturer listed values with final contact arrangement, ambient, temperature rise and derating governed by the original drawing.
Official 9303-E product information
Public source from the named publisher · OUPIIN Enterprise Co., Ltd.
Only the 9303-E model/series and the listed source-supported attributes. Series maximums or model-dependent ranges are identified in the conditions; options and prices are not inferred. Only this explicitly named connector configuration/series is represented; individual member part numbers are not additional quota records. Current figures are manufacturer listed values with final contact arrangement, ambient, temperature rise and derating governed by the original drawing.
Source accessed: 27 October 2026
Content updated 27 October 2026. Source dates describe the documents or the recorded access to them.
How information is documented